Chemistry — Phase: gold–silicon (eutectic)
A low-melting eutectic used in microelectronics bonding.
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title "Gold-silicon (eutectic)"
type binary
basis atomic
component A "Au" melting 1064
component B "Si" melting 1414
// Eutectic 18.6 at% Si at 363 C — 700 C below either component, which
// is what makes Au-Si the die-attach eutectic.
eutectic 0.186 363
region "Liquid" at (0.5, 0.94) color teal
region "Au + liquid" at (0.08, 0.45) color amber
region "Si + liquid" at (0.62, 0.60) color amber
region "Au + Si (eutectic)" at (0.40, 0.15) color purple