Value Stream — Semiconductor Fab Module
Metal-1 module of a 300 mm logic fab: under ten minutes of tool time buried in a 1.5-day module cycle, with CMP over takt at 72% uptime and a 95% rolled throughput yield across five steps.
Make it your own.
title "300 mm logic fab — metal-1 module"
supplier "Bare wafer stocker"
customer "Die sort" demand: 7200/week
available 168h/week # the fab runs continuously
control "MES dispatcher"
process "Litho track + scanner" { ct: 95s; co: 12m; uptime: 78%; operators: 2; shifts: 4; fpy: 98.5%; batch: 25 }
inventory 640 wafers
process Etch { ct: 145s; co: 25m; uptime: 84%; operators: 2; shifts: 4; fpy: 99.1% }
inventory 310 wafers
process "Ash + wet clean" { ct: 70s; uptime: 91%; operators: 1; shifts: 4; fpy: 99.6% }
wait 8h # queue for the polisher
process CMP { ct: 220s; co: 40m; uptime: 72%; operators: 2; shifts: 4; fpy: 97.8% }
inventory 220 wafers
process Metrology { ct: 55s; uptime: 95%; operators: 1; shifts: 4; fpy: 99.9% }
info "Lot dispatch" from control to "Litho track + scanner" electronic
info "SPC feedback" from Metrology to control electronic